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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, . Deleted LM78L82 from the data sheet. LM78L05ACM. LM78L05ACM Texas Instruments | LM78L05ACM-ND DigiKey Electronics Digi -Key Part Number, LM78L05ACM-ND Datasheets, LM78Lxx Datasheet. Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2All trademarks are .. LM78L05ACM. NRND. SOIC. D .

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Used as a Zener-diode and resistor combination replacement, the LM78Lxx usually provides an effective output impedance improvement of two orders of magnitude and lower quiescent current.

LM78L05ACM/NOPB Texas Instruments National Semiconductor | Ciiva

Output Impedance Quiescent Current Figure 9. Description The LM78Lxx series of three terminal positive regulators is available with several fixed output voltages, making them useful in a wide range of applications. The voltages available allow the LM78LXX to be used in logic systems, instrumentation, HiFi, and other solid state electronic equipment. Add to watch list. TI does not datassheet or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual datahseet right relating to any combination, machine, or process in which TI components or services are used.

Recommended minimum load capacitance of 0. Safe area protection for the output transistors is provided to limit internal power dissipation. For additional information, see the Global Shipping Program terms and conditions datssheet opens in a new window or tab. Current limiting is included to limit the peak output current to a safe value.


Have one to sell? Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. TI is not responsible or liable for such altered documentation. This amount is subject to change until you make payment. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer’s risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

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Seller information bg-electronics-de TI has discontinued the production of the device. Products Applications Audio www. Typical thermal resistance values for the packages are: A brand-new, unused, unopened, undamaged item in its original packaging datwsheet packaging is applicable.

Improves ripple rejection and transient response.

Datasheet «LM78LXX»

Dropout Voltage Ripple Rejection Figure 7. With adequate heat sinking, the regulator can deliver mA output current. Select a valid country. These regulators can provide local on card regulation, eliminating the distribution problems associated with single point regulation.

Products conform to specifications per the terms of the Texas Instruments standard warranty. Please enter a lm87l05acm postcode. Information of third parties may be subject to additional restrictions.

Axxess Display Module

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Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. People who viewed this item also viewed.

Product device recommended for new designs. See other items More Packaging should be the same as what is available in a retail store, unless the item was packaged by the manufacturer in non-retail packaging, such as an unprinted box daasheet plastic bag.

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All linear dimensions are in millimeters. Buyers are responsible for their products and applications using TI components. See full item description. See all condition definitions – opens in a new window or tab Production processing does not necessarily include testing of all parameters.

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If internal power dissipation becomes too high for the heat sinking provided, the thermal shutdown circuit takes over preventing the IC from overheating.